Capabilities

Early collaboration with VARIOPRINT enhances the efficiency and quality of your PCB design and final product. Our experienced, process-oriented engineering team provides tailored advice specifically suited to your needs, supporting you in achieving optimal results for your PCB application.

Varioprint supports you with

• Material Expertise
  Guidance on material selection, leveraging our extensive materials database to address any material-related challenges.

• Application-Specific Knowledge
  Expertise in applications tailored to specific markets, including adherence to industry standards and specifications.

• Design Validation
  Verification services for stack-up, preliminary Gerber data, and material selection.

• PCB Design Guidelines
  Comprehensive design rules to optimize PCB performance and reliability.

• Holistic Recommendations

  Advice covering all aspects of PCB development for the best possible outcome.

• Targeted Pre-Studies

  Custom Design of Experiments (DOEs) to tackle specific challenges early on.

• Testing & Measurement Proficiency

  Full range of testing and measurement capabilities to ensure quality and reliability.

Material of all common manufacturers can be offered. High TG FR4 materials,
non-halogen epoxy laminates as well as PTFE high frequency substrates can be
processed.

A small selection:

• Panasonic 1755M (standard 150Tg)

• Isola PCL 370HR (high Tg)

• Panasonic 1566 W (non –halogene FR4)

• Rogers 4000, 3000, 5000 und 6000 Series

• AGC – Neltec and Taconic material

Many other materials are available on request.
Do not hesitate to contact us!

High Performance, thin-film embedded resistor copper foil. Allows, increasing performance and reducing form factor.

Embedded capacitance material (ECM) increases usable board area by allowing for the removal of many, if not all, capacitors equal to or below 0.1 μF and their associated solder joints and vias.

Current status at Varioprint

• Standard: line / space 75µm / 75µm
  Special: line / space 50µm / 50µm

• Standard: via / pad 75µm / 300µm
  Special: via / pad 40µm / 200µm

• Thinnest base copper : 5 – 9µm

• Thinnest base material: 25µm,
  12.5µm in special cases

Please note that achievable line space is depending on total copper thickness. (cladding and plating)

Current status at Varioprint

Varioprint supports you with

• Fusion Bonding of  PTFE material

• Intermittent etching for inner and outer layers

• Plasma etchback

• Modelling of high-frequency engineering materials

• Pre-compensation of high-frequency engineering structures

• Impedance analysis

• High-frequency measurement technology

• Processing of high-frequency technology  circuits up to 200GHz

Laser cavities

Laser cutted cavities for mmIC pockets

High Frequency Waveguide

Waveguide connection integrated into the PCB

Controlled side wall etching for special High Frequency applications

Current status at Varioprint

• Stacked µVias

• Filled Vias up to aspect ratio of 1:1.3

• Filled Vias up to fill grade of 98%
  Depending on via size and diameter

• Via in pad

• Via drill mechanically down to 75µm

• Dual laser drilling for reliable µvia connections

Via in pad with plated through holes

Via in pad with blind Vias

µVia filling on blind holes
Variable fill grade
Also available as via in pad

µVia filling for buried blind vias
Variable filling grade
Also available as via in pad

Through hole filling
Copper Filled Through hole vias

Current status at Varioprint

• Filling/plugging of Vias from 0.5 to 4.0mm PCB thickness

• Filling/plugging of blind Vias with aspect ratio of 1:1

• Filling/plugging of special drilling diameters available on request

• Filling/plugging on order

Plated through holes

Buried vias

Current status at Varioprint

• Boards on aluminum

• Boards on copper

• Integration of thermal vias

• Processing Bergquist semi-finished products

• Processing Laird material

µVia filling on blind holes

variable fill grade
Also available as via in pad

Usable for thermal vias