skip to main content

Flex/rigid-flex PCBs

Facts

Flex

  • Thin materials up to 12.5 µm

  • Characteristics below 50 µm

  • Large variety of materials incl. LCP

  • High-precision laser contour cutting

  • Handling with low space requirements

  • Process environment in medical quality

Rigid-Flex

  • Wide variety of materials in combination with polyimide and adhesive films

  • Stacked and staggered vias

  • Via filling technology

  • Flex section on inner or outer layer

  • Thin stacking structures

Flex and rigid-flex PCBs, versatility for demanding applications

Flex and rigid-flex PCBs from Varioprint offer an innovative solution for modern connection technologies. Thanks to their high versatility and reliability, they have established themselves in sectors such as aerospace, defence, medical technology and industrial electronics. This technology enables assemblies to be designed more reliably, assembly costs to be minimised and space to be used effectively.

Our flex and rigid-flex PCBs are tailored to your requirements, whether for dynamic bending, space constraints, or continuous flexing stress. They are the ideal choice when it comes to connecting moving components or complex geometries. Varioprint stands for the highest quality – from prototypes to series production.

Our experienced engineering team supports you in every phase of your project and helps to realise your requirements efficiently and precisely. Rely on Varioprint for reliable and innovative flex and rigid-flex PCB solutions.

Range of services

Structure and technology

  • Multilayer circuits with symmetrical and asymmetrical design, semi-flex (static bending cycles for assembly) and full-flex design (for dynamic bending cycles) in a wide range of materials

  • Blind vias, buried vias, µvias with and without copper filling as well as plugged via with/without overplating

Dimension and formats

  • Thickness 0.1 mm to 4.8 mm thickness

  • Panel formats used

    • 305x460 mm and 460x610 mm

    • Usable area up to 420x69 mm

Coatings and additional prints

  • Photosensitive solder mask in various colours using spray and screen printing processes

  • Solder mask registration

    • Standard: +–50 µm

    • Special: +–25 µm

  • Additional coatings such as labelling print, peel-off mask and carbon print

Circuit pattern structuring

  • Copper claddings from 18 µm to 210 µm

  • Conductor widths and spacing

    • Standard: 75 µm/100 µm

    • Special: 50 µm/50 µm

Mechanical processing

  • Contour milling

  • Deep routing

  • Scoring

  • Laser processing

Annular rings

  • Standard: 100 µm

  • Special: 75 µm

Materials

  • Tg 135 °C and high Tg 170 °C FR4

  • Halogen-free materials

  • PTFE materials

  • Polyimides (Kapton) and special materials such as LCP (liquid crystal polymers)

End surfaces

  • Various chemical and galvanic gold surfaces as well as chemical tin and silver surfaces or pure organic protective lacquers 

Electroplating and copper plating

  • Aspect ratio up to 1:12 with 0.15 mm drill diameter

  • 1:15 with 0.3 mm drill diameter

  • Copper in vias according to IPC 2, IPC 3 or customised

Discover all our technical possibilities.

Solutions, technologies and materials. Our capabilities.

Selected application examples with flex/rigid-flex PCBs

Do you have questions about our solutions with flex/rigid-flex PCBs?

Do you have questions about our solutions with flex/rigid-flex PCBs?

Sascha Faust

Sales Engineer

Varioprint specialist blog